packaging density
英 [ˈpækɪdʒɪŋ ˈdensəti]
美 [ˈpækɪdʒɪŋ ˈdensəti]
封装密度
双语例句
- Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.
微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。 - Shockproof packaging can be compared with the cutting, forming; due to greater difference in density can also have a wider range of uses.
相对于防震包装可以切割、成型；因密度差异较大，还可以有更为广泛的用途。 - With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。 - Traditional epoxy packaging materials are required for higher performance with the micro electronic packaging density increasing. Composites with high thermal conductivity can be fabricated by addition of ceramic particles or fiber into polymers, and can be used as electronic packaging materials.
微电子封装密度的提高对传统环氧塑封料的导热性能提出了更高的要求，将高导热的陶瓷颗粒/纤维材料添加到聚合物塑封材料中可获得导热性能好的复合型电子封装材料。 - It is compact instructure, insensitive to environmental disturbance, effective in performance as well as high packaging density.
具有体积小，性能稳定及高包装密度等优点。 - Analysis of the Method of Packaging Trap Printing Based on Border Density
基于边界密度的包装印品陷印方法解析 - The application of 0.4 mm pitch CSP used in mobile is getting extensive. The motherboard packaging CSP is developing towards more high density and thin thickness, correspondingly.
4mm间距CSP在移动电话近期得到普及应用，这使得搭栽CSP封装的主板也相应的更加高密度化、薄型化。 - Recombinant adenoviruses were generated by packaging of HEK293 and purified by velocity density gradient centrifugation in caesium chloride solutions.
腺病毒载体经HEK293细胞包装产生含反义片段的重组腺病毒，用氯化铯密度梯度离心法获得纯化的高滴度腺病毒； - A study on Bonding Mechanism of Water-based Modified Starch Adhesive used in the Packaging of Middle Density Fiberboard of Kenaf Stalk
水性改性淀粉胶在包装用麻秆中密度纤维板中胶合机理的研究 - The very large scale monolithic integrated circuits have already reached the limit of integration or miniaturization. If we want to raise its packaging density and expand its function further, developing the three dimensional microwave integrated circuits ( 3DMIC) is the only way.
超大规模单片集成电路已经达到其集成或微型化的极限，要进一步提高其组装密度和扩展功能，唯一的途径就是发展三维微波集成电路（3DMIC）。 - Quad Flat No-lead ( QFN) package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。 - RF designers and packaging designers are facing the challenges to make electronic products with high density, high stability and high functionality.
随着无线通信事业的飞速发展，射频工程师和封装工程师面临着电子产品向更高密度，更高稳定性，和更多功能性发展的挑战。 - Compared with traditional electronic packaging materials, diamond/ copper composites have higher thermal conductivity, lower relative density, thermal expansion coefficient matching with semiconductor materials, etc., which has gained extensive attention as a new generation of electronic packaging materials.
金刚石/铜复合材料由于具有热导率高、密度低、热膨胀系数与半导体材料相匹配等优点，已经成为广受重视的新一代电子封装材料之一。 - Embedded resistors technology can save a lot of packaging surface of PCB, thereby increasing PCB routing flexibility and integration density.
埋嵌电阻技术能够节约大量的PCB安装表面积，从而能够增加PCB的布线自由度和集成密度。 - In order to achieve a faster computing speed and larger storage capacity, both the chip manufacturing process and packaging density keeps improving.
为了获得更快的计算速度和更大的存储容量，芯片的制作工艺不断改进，封装密度不断提高。 - It has the advantage of its excellent characters such as higher packaging precision, smaller module volume, higher I/ O density and shorter distance interconnection.
它具有封装精度高、形成的集成芯片元件占用体积小、输入输出密度高、互连线短等优点。 - Metal matrix composites ( MMCs) reinforced with high content particles were extend applied in aerospace, military, assemble and electric packaging fields due to its specific stiffness and strength, low density and advanced thermal properties.
高体积分数颗粒增强金属基复合材料由于其具有高比刚度、高比强度、低密度和优越的热学性能，使得其被广泛地应用于航空航天、军工、装配和电子封装等领域。 - Electromigration gradually occurs as the key issue in packaging reliability and results in great attention as current density becomes higher with solder interconnects becoming smaller.
随着电子封装互连焊点的尺寸越来越小，焊点内的电流密度越来越大，电迁移逐渐成为影响封装可靠性的关键问题之一引起广泛关注。 - High density packaging is a very important technology in the production of high density, multi-layers, interconnection substrate.
高密度封装一个关键的技术是高密度多层互连基板的制造。